COB ENGINEER STAFF

Job Responsibilities:

1. Responsible for the COB process, including chip bonding, wire bonding, and encapsulation for optical or electronic products.

2. Develop, optimize, and maintain COB process parameters to ensure product quality and production efficiency.

3. Troubleshoot and resolve technical issues related to the COB process during production.

4. Collaborate with R&D teams to evaluate new materials, designs, and process innovations.

5. Conduct reliability testing and failure analysis to improve process stability and product performance.

6. Support production teams with technical guidance and training on COB equipment and processes.

7. Prepare and maintain technical documentation, including SOPs, process reports, and improvement plans.

8. Work closely with suppliers to ensure the quality and availability of COB-related materials and equipment.

Qualifications:

1. Bachelor’s degree or above in Electronics, Optoelectronics, Material Science, or a related field.

2. At least 2 years of experience in COB process development or manufacturing.

3. Familiar with COB-related equipment such as die bonders, wire bonders, and curing systems.

4. Strong understanding of bonding materials, such as adhesives, epoxy, and encapsulants.

5. Experience with optical or semiconductor product manufacturing is preferred.

6. Excellent problem-solving skills and a hands-on approach to process improvement.

7. Good communication and teamwork skills; ability to work collaboratively in a cross-functional team.

8. Proficiency in data analysis and reporting tools.

9. Mandarin is prefer to.

EverPro Technologies Company Limited (EverPro for short) is a high-tech enterprise specializing in the development, production and sales of products including active optical cables (AOC), optical fibers & cables, optoelectronic chips, optoelectronic modules, generic cabling, micro-modular data centers, and passive communication, as well as cabinets and wiring. EverPro owns two subsidiary brands: FIBBR and iCONEC. The company has R&D branches, trading subsidiaries, sales offices and overseas production facilities in Beijing,Hong Kong, the US, Japan, South Korea and Indonesia, along with a global marketing network. Our key strengths include our innovation-driven design capabilities, advanced manufacturing technologies, and our in-house silicon IC design teams and extensive IP portfolio in high-speed, low-power photoelectric conversion, world-class interoperability support and optical fiber innovation. Through our active participation in industry-leading standards such as HDMI, USB-IF, JIIA, VEGA and other global communities, EverPro strives to maintain our technology advancement and leadership, providing the most efficient, coherent and highquality design and production experiences to our global customers.